To check a processor's launch date and whether Embedded Options are available: Go to Intel's product specifications page. Search and open the technical specifications for the processor that you are interested in. For example, search for Xeon Gold Check the Launch Date , which will list the quarter and year. Note this information is just a general guideline. Actual availability and discontinuance timeframes can change.
Second-generation Xeon Scalable Gold was introduced in early Those processors are fabricated on an enhanced 14 nm process based on the Cascade Lake microarchitecture which allows for higher clock speeds and introduced a number of hardware changes against the various speculative execution vulnerabilities. Those processors also introduced new new instructions for the acceleration of machine learning inference as well as support for persistent memory.
From WikiChip. Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. Contact your Intel representative for information on EOL timelines and extended life options.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer nm , indicative of the size of features built on the semiconductor.
Cores is a hardware term that describes the number of independent central processing units in a single computing component die or chip. Processor Base Frequency describes the rate at which the processor's transistors open and close.
The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz GHz , or billion cycles per second. CPU Cache is an area of fast memory located on the processor. A bus is a subsystem that transfers data between computer components or between computers.
Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload.
Refer to Datasheet for thermal solution requirements. VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate.
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions.
See your Intel representative for details. The socket is the component that provides the mechanical and electrical connections between the processor and motherboard. Highly threaded applications can get more work done in parallel, completing tasks sooner. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. Idle States C-states are used to save power when the processor is idle. Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer nm , indicative of the size of features built on the semiconductor.
Cores is a hardware term that describes the number of independent central processing units in a single computing component die or chip. A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Frequency is typically measured in gigahertz GHz , or billion cycles per second. Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. CPU Cache is an area of fast memory located on the processor. A bus is a subsystem that transfers data between computer components or between computers. QPI Quick Path Interconnect links are a high speed, point-to-point interconnect bus between the processor and chipset.
Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload.
Refer to Datasheet for thermal solution requirements. Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. See your Intel representative for details.
Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels. The number of memory channels refers to the bandwidth operation for real world application. Physical Address Extensions PAE is a feature that allows bit processors to access a physical address space larger than 4 gigabytes. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption.
Note that ECC memory support requires both processor and chipset support. Peripheral Component Interconnect Express or PCIe is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard. Highly threaded applications can get more work done in parallel, completing tasks sooner.
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